RESIN SEALING SEMICONDUCTOR PACKAGE AND METHOD AND DEVICE FOR MANUFACTURING THE SAME

Title:

RESIN SEALING SEMICONDUCTOR PACKAGE AND METHOD AND DEVICE FOR MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2005/106942

Kind Code:

A1

Abstract:

A resin sealing semiconductor package and a method and a device for manufacturing the semiconductor package. The method for sealingly molding the semiconductor package is characterized in that a powder or granular resin composition is agitated and molten in an agitating pot having a heating device by rotating an agitating plunger having an agitating bar projected from the tip thereof, the agitated and molten resin is taken out and pressurized in a package shape to manufacture a shaped resin, the shaped resin is mounted on a compression plunger in a drag cavity, and the compression plunger is pressurized after a mold is clamped. Thus, even ifa wire is reduced in size or made highly dense, the flow of the wire is hard to occur.

Inventors:

ITO HIDEO (JP)
UBUKATA TAMAYA (JP)
HIROSE YOSHITAKA (JP)

Application Number:

PCT/JP2004/016534

Publication Date:

November 10, 2005

Filing Date:

November 08, 2004

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
ITO HIDEO (JP)
UBUKATA TAMAYA (JP)
HIROSE YOSHITAKA (JP)

International Classes:

B29B13/02; B29C31/06; B29C31/08; B29C43/18; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C43/18

Foreign References:

JP2001341155A	2001-12-11
JPH08330342A	1996-12-13
JP2004296962A	2004-10-21

Other References: