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Title:
RESIN SHEET AND CIRCUIT BOARD MATERIAL USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/172192
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin sheet having low dielectric properties, and a circuit board material using the same. A resin sheet according to one embodiment of the present invention has at least a resin layer (A) containing a cyclic polyolefin resin copolymer, the crystal melting peak temperature of which is less than 100°C, and exhibits a dielectric loss tangent at 12GHz of less than 0.005.

Inventors:
HAYAKAWA YUUKO (JP)
ISHIHARA TOSHIHISA (JP)
SANO JIRO (JP)
Application Number:
PCT/JP2021/006316
Publication Date:
September 02, 2021
Filing Date:
February 19, 2021
Export Citation:
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Assignee:
MCPP INNOVATION LLC (JP)
International Classes:
B32B5/10; B32B7/025; B32B15/08; B32B27/32; C08F8/04; C08F8/46; C08F297/04; C08J5/18; C08K7/14; C08L23/00; C08L53/02; C08L67/03; C08L69/00; C08L81/06; H05K1/03
Domestic Patent References:
WO2012046443A12012-04-12
WO2012033076A12012-03-15
Foreign References:
JP2017214525A2017-12-07
JP2005239851A2005-09-08
JP2017159590A2017-09-14
JP2011001473A2011-01-06
JP2014105291A2014-06-09
JP2001006437A2001-01-12
Other References:
"PHYSICS TODAY", BLOCK COPOLYMERS-DESIGNER SOFT MATERIALS, February 1999 (1999-02-01), pages 32 - 38
Attorney, Agent or Firm:
KAMADA Naoya et al. (JP)
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