Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN SHEET, PREPREG, INSULATING RESIN MATERIAL, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/009937
Kind Code:
A1
Abstract:
The present disclosure provides a resin sheet (3) which can be used to make an insulating layer having a conductor embedded therein, and with which it is easy to embed the conductor in the insulating layer and moldability is unlikely to deteriorate. This resin sheet (3) contains an uncured product or a semi-cured product of a thermosetting resin composition (X1). The melt viscosity measured using an elevated flow tester is 10 Pa·s to 2,000 Pa·s inclusive at measurement conditions of 130°C and 1 MPa and is 6 Pa·s to 1,200 Pa·s inclusive at measurement conditions of 130°C and 4 MPa.

Inventors:
AOKI TOMOYUKI
YAMAUCHI AKIHIRO
SAITO EIICHIRO
Application Number:
PCT/JP2021/025679
Publication Date:
January 13, 2022
Filing Date:
July 07, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B29B11/16; C08J5/18; H05K1/03; H05K3/46; B29K105/06
Domestic Patent References:
WO2014132654A12014-09-04
Foreign References:
JPH11279493A1999-10-12
JP2003253125A2003-09-10
JP2020098838A2020-06-25
JP2004059896A2004-02-26
JP2000095844A2000-04-04
JPH09186457A1997-07-15
JP2006066738A2006-03-09
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF: