Title:
RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2021/145415
Kind Code:
A1
Abstract:
Provided is a resin sheet formed from a resin composition containing a thermosetting component (A) that contains a maleimide resin. The thermal diffusity of the resin sheet after thermosetting is 1.0 x 10-6m2 / s or more, and the thickness of the resin sheet is between 5 μm and 120 μm.
Inventors:
WATANABE YASUTAKA (JP)
KARASAWA YASUNORI (JP)
UEMURA KAZUE (JP)
KAKIUCHI YASUHIKO (JP)
KARASAWA YASUNORI (JP)
UEMURA KAZUE (JP)
KAKIUCHI YASUHIKO (JP)
Application Number:
PCT/JP2021/001206
Publication Date:
July 22, 2021
Filing Date:
January 15, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08G73/12; C08J5/18; C08K3/013; C08K3/22; C08K3/38; C08K5/103; C08K5/13; C08K5/3492; C08L35/00; C08L79/00; H01L23/29; H01L23/31; H05K1/03
Foreign References:
| JP2018087305A | 2018-06-07 | |||
| JP2019182932A | 2019-10-24 | |||
| JP2016088992A | 2016-05-23 | |||
| JP2020173945A | 2020-10-22 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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