Title:
RESIN SUBSTRATE, COMPONENT-MOUNTING RESIN SUBSTRATE, AND METHOD FOR MANUFACTURING COMPONENT-MOUNTING RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/038790
Kind Code:
A1
Abstract:
A component-mounting resin substrate (10) includes a resin substrate (20) and a component (30). The resin substrate (20) includes a thermoplastic resin element (21). The component (30) is mounted on the resin substrate (20) by ultrasonic bonding. A mounting area in the resin element (21) for the component (30) is provided with holes (23) recessed from the mounting surface for the component (30). At least part of the wall surfaces of the holes (23) has a plating layer (24) that is formed of a material harder than the resin element (21).
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Inventors:
YOSUI KUNIAKI (JP)
SHINAGAWA HIROFUMI (JP)
ITO YUKI (JP)
SHINAGAWA HIROFUMI (JP)
ITO YUKI (JP)
Application Number:
PCT/JP2016/075264
Publication Date:
March 09, 2017
Filing Date:
August 30, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01L23/12; H05K3/32
Domestic Patent References:
| WO2013069763A1 | 2013-05-16 |
Foreign References:
| JP2000068328A | 2000-03-03 | |||
| JP2004327721A | 2004-11-18 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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