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Title:
RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/150361
Kind Code:
A1
Abstract:
Provided is a resin substrate (10) comprising: a first portion (P01) constituted by resin sheets (101, 102, 103) at one end side in a lamination direction; and a second portion (P02) constituted by resin sheets (104, 105, 106) at the other end side in the lamination direction. The thickness of the plurality of resin sheets (101-106) is approximately the same in the first portion (P01) and the second portion (P02). The density of a planar conductor pattern (210) of the first portion (P01) relative to the volume of the first portion (P01) is less than the density of a planar conductor pattern (220) of the second portion (P02) relative to the volume of the second portion (P02). The average diameter φ10 of an interlayer connection conductor (310) formed in the first portion (P01) is greater than the average diameter φ20 of an interlayer connection conductor (320) formed in the second portion (P02).

Inventors:
ADACHI TOSHIRO (JP)
Application Number:
PCT/JP2017/007010
Publication Date:
September 08, 2017
Filing Date:
February 24, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Foreign References:
JP2016018858A2016-02-01
JP2014199948A2014-10-23
JP2009152282A2009-07-09
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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