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Title:
RESINOUS MATERIAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/213520
Kind Code:
A1
Abstract:
The present invention provides: a resinous material which comprises a phenolic resin and a dicyandiamide polymer finely dispersed in the phenolic resin; and a method for producing the resinous material, which comprises a phenolic resin and a dicyandiamide polymer dispersed in the phenolic resin, the method comprising a step in which a resin composition comprising a phenolic resin and dicyandiamide is prepared and a step in which the resin composition is heated to polymerize the dicyandiamide and form a dicyandiamide polymer.

Inventors:
MIFUKA HAJIME (JP)
Application Number:
PCT/JP2020/016085
Publication Date:
October 22, 2020
Filing Date:
April 10, 2020
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G12/16; C08K5/3467; C08L61/06; C08L61/28; C09K3/14
Foreign References:
JP2004155965A2004-06-03
JP2004154804A2004-06-03
JPS4743314B11972-11-01
JPS53149295A1978-12-26
JP2013142142A2013-07-22
JP2019079974A2019-05-23
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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