Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/048021
Kind Code:
A1
Abstract:
Provided are: a resist underlayer film-forming composition which has excellent embedding and flattening properties for stepped substrates, excellent storage stability, a low film-curing start temperature and a small amount of sublimate generation, and can form a film that does not dissolve in photoresist solvents; a method for forming a resist pattern using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition contains: a thermal acid generator represented by formula (I) below; a Novolac resin polymer (G) in which (i) a unit structure having an aromatic ring optionally having a substituent and (ii) a unit structure containing an aromatic cyclic organic group optionally having a substituent, a non-aromatic monocyclic organic group optionally having a substituent, or a 4- to 25-membered bicyclic, tricyclic, or tetracyclic organic group containing at least one non-aromatic monocyclic ring and optionally having a substituent are bonded via a covalent bond between a carbon atom on the aromatic ring of the unit structure (i) and a carbon atom on the non-aromatic monocyclic ring of the unit structure (ii); and a solvent. (A-SO3)-(BH)+ [In formula (I), A is an optionally substituted linear, branched, or cyclic saturated or unsaturated aliphatic hydrocarbon group, an optionally substituted aryl group, or an optionally substituted heteroaryl group, and B is a base having a pKa of 6.5 or greater.]
Inventors:
TOKUNAGA HIKARU (JP)
NAKAJIMA MAKOTO (JP)
NISHIMAKI HIROKAZU (JP)
NAKAJIMA MAKOTO (JP)
NISHIMAKI HIROKAZU (JP)
Application Number:
PCT/JP2022/034228
Publication Date:
March 30, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C07C211/04; C07C211/05; C07C211/06; C07C309/04; C07C309/06; C07C309/25; C07C309/30; C07C309/35; C07C309/40; C09K3/00
Domestic Patent References:
| WO2021106536A1 | 2021-06-03 | |||
| WO2019208212A1 | 2019-10-31 |
Foreign References:
| JP2011164345A | 2011-08-25 | |||
| JP2008039811A | 2008-02-21 | |||
| JP2021071660A | 2021-05-06 | |||
| JP2012013872A | 2012-01-19 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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