Title:
RESONANCE DEVICE, COLLECTIVE BOARD, AND RESONANCE DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/044397
Kind Code:
A1
Abstract:
Provided are a resonance device, a collective board, and a resonance device manufacturing method with which it is possible to suppress propagation of noise through a holding portion. A resonance device 1 is provided with: a MEMS board 50 including a resonator 10 having a vibrating portion 110 and a holding portion 140 configured to hold the vibrating portion 110; and an upper lid 30 disposed opposite the MEMS board 50 across the resonator 10 and including a connection wiring CW1 electrically connected to the vibrating portion 110. The resonator 10 further includes an isolating groove 145 formed to surround the vibrating portion 110 in plan view.
Inventors:
FUKUMITSU MASAKAZU (JP)
UEDA TAKASHI (JP)
UEDA TAKASHI (JP)
Application Number:
PCT/JP2021/010275
Publication Date:
March 03, 2022
Filing Date:
March 15, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H3/02; H03H9/02; H03H9/24
Domestic Patent References:
| WO2020070942A1 | 2020-04-09 |
Foreign References:
| JP2006211310A | 2006-08-10 | |||
| JP2013051512A | 2013-03-14 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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