Title:
RESONATOR MANUFACTURING METHOD AND RESONATOR
Document Type and Number:
WIPO Patent Application WO/2022/063053
Kind Code:
A1
Abstract:
A resonator manufacturing method, comprising: forming a sacrificial layer pattern on a substrate; forming a lower electrode on the sacrificial layer pattern; forming a second sacrificial layer pattern on the lower electrode; forming a piezoelectric layer and an upper electrode on the second sacrificial layer pattern and the lower electrode; optionally forming a third sacrificial layer pattern; and removing the sacrificial layer pattern, leaving an air gap, and forming a resonant cavity. The present invention further relates to a resonator.
Inventors:
TANG ZHAOYUN (CN)
TANG BIN (CN)
WANG JIAYOU (CN)
LAI ZHIGUO (CN)
YANG QINGHUA (CN)
TANG BIN (CN)
WANG JIAYOU (CN)
LAI ZHIGUO (CN)
YANG QINGHUA (CN)
Application Number:
PCT/CN2021/119027
Publication Date:
March 31, 2022
Filing Date:
September 17, 2021
Export Citation:
Assignee:
SUZHOU HUNTERSUN ELECTRONICS CO LTD (CN)
International Classes:
H03H3/02; H03H9/02; H03H9/17
Foreign References:
CN112117986A | 2020-12-22 | |||
CN112087209A | 2020-12-15 | |||
CN109714016A | 2019-05-03 | |||
CN105680813A | 2016-06-15 | |||
US20130235001A1 | 2013-09-12 |
Attorney, Agent or Firm:
FAIRSKY LAW OFFICE (CN)
Download PDF:
Previous Patent: PRE-LOADING CHAMBER AND SEMICONDUCTOR PROCESSING PLATFORM
Next Patent: LIFTING ASSEMBLY
Next Patent: LIFTING ASSEMBLY