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Patent Searching and Data


Title:
RF PACKAGE MODULE AND ELECTRONIC DEVICE COMPRISING RF PACKAGE MODULE
Document Type and Number:
WIPO Patent Application WO/2019/078408
Kind Code:
A1
Abstract:
The present invention relates to research (No. GK17N0100, millimeter-wave 5G mobile communication system development) carried out with the support of the "pan-government Giga KOREA project" funded by the government (Ministry of Science and ICT) in 2017. Provided are an RF package module according to various embodiments and an electronic device comprising the RF package module. An RF package module according to an exemplary embodiment may comprise a multilayer circuit board, which comprises: a sub-module comprising a radio frequency integrated chip (RFIC); an antenna for wirelessly transmitting and receiving a signal through a predetermined metal pattern; and a plurality of layers in which a signal via for transmitting signals between the RFIC and the antenna and one or more ground vias are disposed, wherein the antenna and the one or more ground vias are separated by one or more anti-pads.

Inventors:
BAEK KWANG-HYUN (KR)
PARK SANGWOOK (KR)
KAM DONG GUN (KR)
LEE YOUNG-JU (KR)
Application Number:
PCT/KR2017/014237
Publication Date:
April 25, 2019
Filing Date:
December 06, 2017
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
UNIV AJOU IND ACADEMIC COOP FOUND (KR)
International Classes:
H05K1/02; H05K1/11; H05K3/34
Foreign References:
KR20160132649A2016-11-21
US20120212384A12012-08-23
US20090207080A12009-08-20
KR101136423B12012-04-19
KR20130042909A2013-04-29
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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