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Patent Searching and Data


Title:
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/277343
Kind Code:
A1
Abstract:
Provided is an electronic device comprising: a PCB having a first alignment mark formed on a first surface; and an RFPCB comprising a plurality of layers, wherein the RFPCB comprises: a rigid portion disposed on one surface of the PCB; a flexible portion extending from the rigid portion; and a first protrusion portion in which any one of the plurality of layers extend to protrude from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is formed on the first protrusion portion. The first protrusion portion may at least partially overlap the first alignment mark of the PCB.

Inventors:
YANG HYUNMO (KR)
UHM JUNWHON (KR)
PARK YONGHYUN (KR)
LEE YONGWON (KR)
HA SANGWON (KR)
Application Number:
PCT/KR2022/007084
Publication Date:
January 05, 2023
Filing Date:
May 18, 2022
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H05K1/03; H05K1/09; H05K1/11; H05K3/28; H05K3/46
Foreign References:
KR102053825B12019-12-09
KR20160080871A2016-07-08
KR20170140691A2017-12-21
JP2011129554A2011-06-30
JP2011049367A2011-03-10
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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