ROTARY GRINDSTONE

WIPO Patent Application WO/2020/161869

A1

An annular rotary grindstone 10 having an offset base section 11 that is axially offset, said rotary grindstone being provided with: an outer circumferential grinding section 42 which extends in the shape of an annulus along the outer circumference of the rotary grindstone 10 on a surface on the side opposite the offsetting direction of the offset base section 11, the difference between the outer and inner diameters of said annulus being 0.2-0.6 in relation to the radius R of the rotary grindstone 10; and an inner circumferential grinding section 43 which adjoins the outer circumferential grinding section 42 and extends in the shape of an annulus on the inner circumferential side thereof. When a grinding ratio is a ratio obtained by dividing the ground amount of a ground object, after grinding, by the abrasion amount of the ground object, the grinding ratio of an A material 44 used for the outer circumferential grinding section 42 is larger than the grinding ratio of a B material 45 used for the inner circumferential grinding section 43.

JPH0644590	[Name of device] Work piece support device
JPH071306	POLISHING METHOD AND POLISHING DEVICE

INOUE TAKASHI (JP)
MIZUNO KEI (JP)
FUJIKI HIROMU (JP)
OOTA TADAFUMI (JP)

PCT/JP2019/004466

August 13, 2020

February 07, 2019

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NIPPON RESIBON CORP (JP)

B24B7/17

JPH08132349A	1996-05-28
JPS6311283A	1988-01-18
JP2017024091A	2017-02-02
JPH11277446A	1999-10-12
JP2005111626A	2005-04-28
JP2009072884A	2009-04-09
US5496209A	1996-03-05

MAEDA & PARTNERS (JP)

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