Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ROUND FIBER-REINFORCED PLASTIC WIRE, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED SHEET
Document Type and Number:
WIPO Patent Application WO/2008/111679
Kind Code:
A1
Abstract:
A round fiber-reinforced plastic wire that realizes lifting of restrictions on molding speed and on the number of wires produced once, nonuse of any mold release agent, avoiding of post-molding roughening and other work, attaining of substantial cutback of production cost and attaining of substantial improvement of product quality; a process for producing the round fiber-reinforced plastic wire; and a relevant fiber-reinforced sheet. The process for producing a round fiber-reinforced plastic wire comprises the steps of (a) continuously feeding, while twisting, reinforcing fiber bundle (f1) composed of unidirectionally aligned multiple reinforcing fibers; (b) impregnating the continuously fed reinforcing fiber bundle (f1) with matrix resin (R); and (c) heating the resin impregnated reinforcing fiber bundle (f2) while applying a tension of given intensity so as to provide the reinforcing fiber bundle with a circular cross section and harden the resin, so that fiber-reinforced plastic wire (2) with a circular cross section is obtained.

More Like This:
Inventors:
TAKEDA TOSHIKAZU (JP)
SHIMADA MASAKI (JP)
HINO HIDEHIKO (JP)
ARAZOE MASAKI (JP)
Application Number:
PCT/JP2008/054834
Publication Date:
September 18, 2008
Filing Date:
March 10, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON STEEL COMPOSITE CO LTD (JP)
TAKEDA TOSHIKAZU (JP)
SHIMADA MASAKI (JP)
HINO HIDEHIKO (JP)
ARAZOE MASAKI (JP)
International Classes:
C08J5/24; B29C70/06; E04C5/07
Foreign References:
JP2006069188A2006-03-16
JPS6312786A1988-01-20
JPH0890656A1996-04-09
JPH0839680A1996-02-13
JP2004197325A2004-07-15
JP2004197325A2004-07-15
Other References:
See also references of EP 2123701A4
Attorney, Agent or Firm:
KURAHASHI, Akira (16-5 Shinbashi 5-chom, Minato-ku Tokyo 04, JP)
Download PDF: