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Patent Searching and Data


Title:
SANDWICH PANEL COMPRISING PHENOLIC RESIN CURED FOAM, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/009080
Kind Code:
A2
Abstract:
The present invention relates to a sandwich panel comprising a phenolic resin cured foam and to a production method therefor, and, more specifically, relates to technology for providing an outstandingly reliable sandwich panel by using a phenolic resin cured foam to form a core layer between non-combustible plate materials on the front surface and the back surface, thereby imparting a high level of thermal insulation performance, with a thermal conductivity of no more than 0.02 W/mK, and at the same time resolving the problem of corrosion at the surfaces adhering to the plate materials.

Inventors:
KIM JUNG KEUN (KR)
LEE EUNG KEE (KR)
LEE MIN HEE (KR)
KIM MYEONG HEE (KR)
KIM JI MUN (KR)
Application Number:
PCT/KR2012/005477
Publication Date:
January 17, 2013
Filing Date:
July 11, 2012
Export Citation:
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Assignee:
LG HAUSYS LTD (KR)
KIM JUNG KEUN (KR)
LEE EUNG KEE (KR)
LEE MIN HEE (KR)
KIM MYEONG HEE (KR)
KIM JI MUN (KR)
International Classes:
E04C2/296; E04B2/36
Foreign References:
JP2003056089A2003-02-26
KR100922175B12009-10-19
KR20080053285A2008-06-12
KR20110049004A2011-05-12
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
특허법인 대아 (KR)
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Claims: