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Patent Searching and Data


Title:
SCALABLE MOLD STRUCTURE AND FOAM PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/147645
Kind Code:
A1
Abstract:
Disclosed are a scalable mold structure (10) and a foam preparation method thereof. The scalable mold structure comprises an upper cover (11) and a bottom cover (13), wherein the upper cover (11) can cover the bottom cover (13), and an accommodating space (12) is formed between the upper cover and an indented portion of the bottom cover (13); a scalable structure is arranged between the upper cover (11) and the bottom cover (13) so that the range of the accommodating space (12) can be adjusted; and by means of the design of the scalable mold structure, pressurization or multiple pressing can be properly carried out according to the requirement of a foam material in the foam preparation method, and therefore, the compression density and the thermal conductivity of the foam material are improved, the molding density and the thickness of foam molding can be controlled, the surface flatness is improved, and the product yield is also improved.

Inventors:
LIN PO-CHANG (CN)
CHIN KUANG-TSE (CN)
YU YA-CHUN (CN)
HSIEH JUNG-HSIANG (CN)
Application Number:
PCT/CN2020/142207
Publication Date:
July 29, 2021
Filing Date:
December 31, 2020
Export Citation:
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Assignee:
HERLIN UP CO LTD (CN)
International Classes:
B29C44/02; B29C44/10
Foreign References:
US5547621A1996-08-20
CN209955142U2020-01-17
CN209737878U2019-12-06
CN107073768A2017-08-18
CN110042268A2019-07-23
CN209335962U2019-09-03
CN207669646U2018-07-31
US5328345A1994-07-12
US20160039162A12016-02-11
CN209454035U2019-10-01
CN103921421A2014-07-16
CN1332076A2002-01-23
CN110625891A2019-12-31
CN109648798A2019-04-19
US7070720B22006-07-04
US10118443B22018-11-06
DE4300376C11994-01-05
DE3842846A11990-06-21
Other References:
See also references of EP 4094917A4
Attorney, Agent or Firm:
BEIJING HUI & XIN IP LAW OFFICE (CN)
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