BACKGROUND

[0001] It may be helpful to screen memory devices so that the memory devices will perform reliably. Screening may involve testing memory devices in a less stable state with the assumption that if a device functions properly in the less stable state, it will also function properly in a stable state. A less stable state may be a state that is prone to disturbs. A less stable state may be achieved by placing the memory device under stress by, for example, varying temperature. Screening may provide an operational margin by identifying parts that function properly in the less stable state.

[0002] For memory devices comprising planar transistors— i.e., transistors with active drain and source portions planar with the oxide or insulator layer, screening may involve modulating the N- well to place the place the memory devices in a less stable state. Modulation, as used herein, means applying a higher or lower voltage as compared to a nominal operating voltage. Such a method, however, may not be available for memory devices using fin field-effect (FinFET) transistors, which have active drain and source portions that protrude above the oxide or insulator layer in a fin-like manner. The active drain and source portions of a FinFET transistor may not be impacted by changes to the N-well due to the distance between the active drain and source portions and the N-well in the FinFET transistor architecture.

SUMMARY

[0003] Illustrative examples described herein include a method of screening a memory cell. The illustrative method includes overdriving or underdriving a wordline as compared to a nominal operating voltage on the wordline. The method further includes reading the memory cell to obtain a cell value and comparing the cell value to an expected value.

[0004] Illustrative examples described herein also include a method of screening a memory cell having a first bitline, a second bitline and a wordline. The illustrative method includes writing a write value to the memory cell by overdriving or underdriving one of the first bitline and second bitline as compared to a nominal operating voltage of the first bitline and the second bitline. The method also includes reading the memory cell to obtain a cell value; and comparing the cell value to an expected value.

[0005] Illustrative examples described herein also include a built-in self test (BIST) system for screening a memory array. The illustrative BIST system includes an external interface configured to receive a test program having a plurality of instructions. The plurality of instructions includes read instructions, write instructions or a combination of read instructions and write instructions. The BIST system also includes a control engine configured to control operation of the BIST system to screen the memory array based on the plurality of instructions, and an address/data generator configured to be controlled by the control engine to generate, based on the plurality of instructions, an address for read instructions and write instructions and test data to be written to the memory array for write instructions. The BIST system further includes a write/read control generator configured to be controlled by the control engine to generate a write/read memory instruction based on the plurality of instructions, and to provide to the memory array, the write/read instruction being one selected from a memory read instruction and a memory write instruction. The BIST system also includes a wordline margin control configured to be controlled by the control engine to modulate a wordline voltage for a wordline in the memory array based on the plurality of instructions, a bitline margin control configured to be controlled by the control engine to modulate a bitline voltage for a bitline in the memory array based on the plurality of instructions and an output comparator configured to receive read data from the memory array and compare the read data to expected values to obtain test results.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 shows an illustrative memory cell;

[0007] FIG. 2 shows an illustrative method for using a read instruction to screen the memory cell of FIG. 1;

[0008] FIG. 3 shows an illustrative method for using a write instruction to screen the memory cell of FIG. 1;

[0009] FIG. 4 shows an illustrative built-in self-test system; and

[0010] FIG. 5 shows an illustrative method of operating the built-in self-test system of FIG. 4. DETAILED DESCRIPTION OF EXAMPLE EMBOIMENTS

[0011] In this description, the term“couple” or“couples” means either an indirect or direct wired or wireless connection. Thus, if a first device couples to a second device, that connection may be through a direct connection or through an indirect connection via other devices and connections.

[0012] FIG. 1 shows an illustrative 6-transistor static random access memory (SRAM) memory cell 1 having transistors Ml, M2, M3, M4, M5 and M6. Access transistor Ml couples a bitline BL 7 to a node A, and access transistor M6 couples a bitline BB 8 to a node B. Drain terminals of transistors M2 and M3 are coupled together at the node A. A source terminal of transistor M2 is coupled to a power source (for example, VCC) and a source terminal of transistor M3 is coupled to VSS (for example, ground). Drain terminals of transistors M4 and M5 are coupled together at the node B. A source terminal of transistor M4 is coupled to a power source (for example, VCC) and a source terminal of transistor M5 is coupled to VSS (for example, ground). Gate terminals of transistors M2 and M3 are coupled together and to the node B. Gate terminals of transistors M4 and M5 are coupled together and to the node A. Transistors M2 and M4 have N-wells 5 and 6, respectively. The gate terminals of access transistors Ml and M6 are coupled to a wordline WL 2. In FIG. 1, transistors M2 and M4 comprise p-type metal oxide semiconductor field effect transistors (PMOS transistors) and transistors Ml, M3, M5 and M6 comprise n-type metal oxide semiconductor field effect transistors (NMOS transistors). Other architectures of a memory cell may be implemented as well.

[0013] If transistors Ml, M2, M3, M4, M5 and M6 are planar transistors, memory cell 1 may be screened by modulating the voltage on N-wells 5 and 6 to create margin. Such a method of screening, however, is not available if transistors Ml, M2, M3, M4, M5 and M6 are FinFET transistors. The N-well region may be on the opposite side of the transistor from the active portions, and in FinFET transistors the active portions extend away from the surface of the transistor opposite the N-well, and therefore farther from the N-well. In this way, the distance between the N-well region and active drain and source portions is greater in FinFET transistors than in planar transistors. As such, biasing the N-wells in FinFET transistors may not impact the active drain and source portions of the transistors as the electrons have too far to travel.

[0014] FIG. 2 shows an illustrative method of screening the memory cell 1 during a read operation by modulating the voltage on the wordline WL 2, rather than the N-wells 5 and/or 6. The method of FIG. 2 may, therefore, be used for screening FinFET memory cells or planar memory cells. The screening method of FIG. 2 is performed, for example, at a factory as a quality check before a chip is used in the field.

[0015] At step 201, the wordline WL 2 is driven to a higher or lower voltage than a nominal operating voltage of the wordline WL 2. For example, the wordline WL 2 may be driven to +/- 5% of the nominal operating voltage. At step 202, the bitlines BL 7 and BB 8 are read (for example, by a comparator) and the cell value is computed. For example, the value of the cell may be determined by calculating the difference between the voltage on the bitline BL 7 and the voltage on the bitline BB 8. At step 203, the computed cell value is compared to an expected cell value. If the values are the same, the cell passes screening having sufficient margin.

[0016] FIG. 3 shows an illustrative method of screening the memory cell 1 during a write operation by modulating a voltage on a bitline BL 7 or BB 8 and/or wordline WL 2, rather than the N-wells 5 and/or 6. The method of FIG. 3 may, therefore, be used for screening FinFET memory cells or planar memory cells. The screening method of FIG. 3 is performed, for example, at a factory as a quality check before a chip is used in the field.

[0017] At step 301, the bitlines BL 7 and BB 8 are pre-charged high, for example to a nominal operating voltage of the bitlines BL 7 and BB 8. At step 302, the bitline BL 7 or BB 8 corresponding to the value to be written is driven to a higher or lower voltage than would be used for a write operation in the field. During a write operation, the bitline BL 7 may be driven low to write a“0” and the bitline BB 8 may be driven low to write a“1,” or vice versa. The bitline BL 7 or BB 8 should be driven low enough to ensure that the corresponding access transistor Ml or M6 is able turn on the corresponding PMOS transistor M4 or M2. For example, if the bitline BL 7 or BB 8 may be pulled down to 0 volts for a write operation, it may instead be driven to +/- 100 mV. At step 303, the wordline WL 2 is driven to a higher or lower voltage than the nominal voltage of the wordline WL 2. For example, the wordline WL 2 may be driven to +/- 5% of the nominal operating voltage.

[0018] At step 304 the memory cell 1 is read. The worldline WL 2 may optionally be over or under driven during step 304, as described in step 201 of FIG. 2. At step 305 the value read at step 304 is compared to the value written in steps 301-303. If the values are the same, the cell passes the screening having sufficient margin. While the method of figure 3 shows both the bitline BL 7 or BB 8 and the wordline WL 2 being over or under driven to place the cell into a less stable state, the method may alternatively involve over or under driving only the bitline BL 7 or BB 8 or only the wordline WL 2.

[0019] FIG. 4 shows an illustrative diagram of a built-in self-test (BIST) system 400, which may be used in a factory before shipment of the chips to perform the methods of FIGS. 2 and/or 3 on memory cells in a memory array 401. Memory array 401 may be, for example, an SRAM memory array that comprises multiple memory cells like memory cell 1 of FIG. 1. BIST system 400 includes a control engine 406 coupled to a bitline margin control 402, a wordline margin control 403, a write/read control generator 404 and an address/data generator 405. Control engine 406 may be, for example, a processor or computer, and controls the operations of the other components of the BIST 400 based on, for example, software stored in memory 409. As described in more detail below, the software may include test programs that instruct the control engine 406 to test the memory array 401 by writing to and/or reading from individual cells of the memory array 401 using voltages that vary from a nominal operating voltage.

[0020] To that end, bitline margin control 402 may be a voltage biasing circuit and may provide a modulated voltage, as specified by the test program, on a bitline in memory array 401 (for example, bitline BL 7 and/or BB 8). Wordline margin control 403 may be a voltage biasing circuit and may provide a modulated voltage, as specified by the test program, to a wordline in memory array 401 (for example, wordline WL 2). Bitline margin control 402 and wordline margin control 403 may also be circuitry that provides control data to the memory array 401 to allow the memory array 401 to adjust the voltage on the bitline or wordline, respectively, based on the control data.

[0021] BIST system 400 also includes an output comparator 408 for receiving read data from the memory array 401 and comparing the data read to the data written to determine if the memory cells being tested have the expected values. If the values match, it may indicate that the respective cells have sufficient operating margin. BIST system 400 further includes an external interface 407 for receiving test programs and/or for outputting the results of a test program to, for example, an external computer.

[0022] FIG. 5 shows an example method of screening a cell or cells in memory array 401 using BIST system 400. The screening method of FIG. 5 is performed, for example, at a factory as a quality check before a memory array chip is used in the field. At step 501, a test program is received at the external interface 407 from, for example, an external computer. The external interface 407 may store the program, for example, in memory 409. The test program may be, for example, a series of write and/or read instructions according to the methods of figures 2 and 3. For example, a write instruction may have the following format:

Write ^BL1 _WL2 A0, DO

where Write identifies the instruction as a write instruction, DO is the data to be written, and A0 is the address to which the data should be written. BL1 is a bitline voltage modulation value that specifies the voltage to be applied to the bitline during the course of the write operation. The bitline modulation value may specify the voltage by indicating the voltage directly, by indicating an offset from a nominal voltage specified elsewhere, or by other suitable means. Similarly, WL2 is a wordline voltage modulation value and may specify the voltage to be applied to the wordline during the course of the write operation by indicating the voltage directly, by indicating an offset from a nominal voltage specified elsewhere, or by other suitable means.

[0023] A sample read instruction may be:

Read _WL2 A 0

where Read identifies the instruction as a read instruction, AO is the address from which the data should be read and WL2 is a wordline modulation value that specifies the voltage to be applied to the wordline during the course of the read operation. The wordline modulation value may specify the voltage by indicating the voltage directly, by indicating an offset from a nominal voltage specified elsewhere, or by other suitable means. The test program may contain instructions with voltage modulation values, such as those described above, interspersed with instructions for reads and/or writes to be performed at nominal voltages.

[0024] At step 502, the control engine 406 obtains the test program from memory 409. At step 503, the control engine 406 gets or reads the next instruction in the test program, which may be a read instruction or a write instruction with or without a voltage modulation value. The control engine 406 may get the first instruction if no other instructions have yet been processed.

[0025] At step 504, the control engine 406 prepares instructions and data to send to the memory array 401 to execute the instruction from the test program. This preparation may involve causing the address/data generator 405 to generate a sequence of addresses to be read from or written to based, for example, on the value A0 in the instruction from the test program. The addresses may correspond to some or all of the memory cells in the memory array 401 under test. As performance may have a spatial component, the addresses may correspond to a physical pattern, for example, a checkerboard pattern, a row stripe pattern, or a column stripe pattern, distributed over the memory cells of the memory array 401.

[0026] For a write instruction, the control engine 406 may cause the address/data generator 405 to generate test data to be written based, for example, on the value DO in the instruction from the test program. The generated test data may be, for example, a series of Is and 0s that is a binary representation of the value DO.

[0027] The control engine 406 may also cause the write/read control generator 404 to generate signals that cause the memory array 401 to carry out the corresponding write or read instruction for each address based, for example, on the instruction from the test program. These signals may include a write enable signal or read enable signal provided to a write enable input or read enable input, respectively, of the memory array 401. A read enable signal sent to a read enable input or a write enable signal sent to a write enable input may instruct the memory array to read to or write from, respectively, the memory array at the addresses provided to the memory array 401, for example through an address input in the memory array 401. The form of the instructions and data sent to the memory array 401 generally depends on the requirements of the memory array 401.

[0028] The control engine 406 may also instruct the bitline margin control 402 and/or wordline margin control 403 to modulate the voltage on a bitline and/or wordline based on, for example, the BL1 and WL2 values in the instruction from the test program. In the example where bitline margin control 402 and wordline margin control 403 are biasing circuits, bitline margin control 402 and/or wordline margin control 403 will generate the voltages based on the BL1 and WL2 values, respectively. In the example where bitline margin control 402 and wordline margin control 403 is circuitry that generates modulation control values, the bitline margin control 402 and/or wordline margin control 403 may generate a modulation control value that corresponds to BL1 and/or WL2, respectively, based on the requirements of the memory array 401. For example, the wordline margin control 403 may provide the memory array 401 a modulation control value of “0” to indicate a wordline voltage that is offset from a nominal voltage by OmV, a modulation control value of“1” to indicate a wordline voltage that is offset from a nominal voltage by 300m V, and a modulation control value of“2” to indicate a wordline voltage that is offset from a nominal voltage by -300mV. In another example, where the wordline margin control 403 specifies the wordline voltage directly, the wordline margin control 403 may provide the memory array 401 a modulation control value of “0” to indicate a read or write performed at a wordline voltage of OmV, a modulation control value of“1” to indicate a read or write performed at a wordline voltage of 300mV, and a modulation control value of“2” to indicate a read or write performed at a wordline voltage of -300mV.

[0029] At step 505, the BIST system 400 sends the read and/or write instructions generated in step 504 to the memory array 401. The instructions and/or data generated in step 504 may be sent to the BIST system 400 by the component that generated the respective instructions and/or data (for example, bitline margin control 402, a wordline margin control 403, a write/read control generator 404 and/or an address/data generator 405). In the case of a write instruction, the data generated in step 504 is written to the appropriate memory location in memory array 401. In the case of a read instruction, the cells at the specified address are read.

[0030] At step 506, if the instruction is a read instruction, memory array 401 outputs the read data to the output comparator 408. Output comparator 408 compares the results of the read instruction to the expected result, which may be stored in memory 409, to test whether the read data matches the expected result. The comparator 408 provides the result of the comparison to control engine 406. At step 507, the control engine 406 determines if any instructions remain in the test program that have not been executed. If so, the control engine 406 reads the next read or write instruction at step 503, and that instruction is processed in steps 504-506. If there are no instructions remaining in the test program, at step 508 the control engine 406 outputs the results of the test program at the external interface 407. Alternatively, the results of the test program may be output to the external interface 407 as they are generated and/or may be stored in memory 409.

[0031] Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.