Title:
SEALANT MOLDING DEVICE AND SEALANT APPLICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/203398
Kind Code:
A1
Abstract:
A sealant molding device (10) is provided with: a molding member (30) having a molding surface (32) facing an application surface; a cover (20) retaining the molding member (30); a recessed section (24), in the cover (20), that is provided adjacent to a first side in a continuing direction in which the application surface is continuous with respect to the molding member (30), and that is recessed more than the molding surface (32) in a direction separating from the application surface; and a sealant supply part that can supply a sealant (100) to inside the recessed section (24).
Inventors:
KATAYAMA TETSUYA (JP)
Application Number:
PCT/JP2020/012637
Publication Date:
October 08, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B05C17/005; B05B1/02; B05C5/00; B05D1/26; B05D7/24
Foreign References:
| JP2015209729A | 2015-11-24 | |||
| JPH0866657A | 1996-03-12 | |||
| US20060005339A1 | 2006-01-12 | |||
| JP2016107190A | 2016-06-20 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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