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Title:
SEALING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/099055
Kind Code:
A1
Abstract:
Provided is an organic EL element sealing composition which is to be used as a dam material when sealing an organic EL element using the dam-and-fill method, and capable of protecting the organic EL element by efficiently forming a dam that exhibits moisture-proofing properties and low outgassing, and avoids directly exposing the organic EL element to UV light. This organic EL element sealing composition is to be used as a dam material when sealing an organic EL element using the dam-and-fill method, and contains a component (A), a component (B), a component (C), and a component (D), wherein: the component (A) is a cationic curable compound having, in each molecule thereof, two or more groups selected from an alicyclic epoxy group, an oxetane ring-containing group, an episulfide group, and a vinyl ether group; the component (B) is a photo-cationic polymerization initiator; the component (C) is one or more types of compounds selected from an N-glycidyl compound, an N-vinyl compound, and an N-aryl compound; and the component (D) is an inorganic filler.

Inventors:
EGAWA TOMOYA (JP)
Application Number:
PCT/JP2016/086168
Publication Date:
June 15, 2017
Filing Date:
December 06, 2016
Export Citation:
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Assignee:
DAICEL CORP (JP)
International Classes:
H05B33/10; C08F2/50; C08G65/18; C08L63/00; H01L51/50; H05B33/04
Domestic Patent References:
WO2015178186A12015-11-26
Foreign References:
JP2015120889A2015-07-02
JP2015151528A2015-08-24
JP2013157204A2013-08-15
JP2014105286A2014-06-09
JP2001139933A2001-05-22
Attorney, Agent or Firm:
GOTO & CO. (JP)
Patent business corporation Goto patent firm (JP)
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