Title:
SEAMLESS STEEL PIPE HEAT TREATMENT/PURIFICATION-DIRECTED FACILITY
Document Type and Number:
WIPO Patent Application WO/2019/189158
Kind Code:
A1
Abstract:
The present invention provides a seamless steel pipe heat treatment/purification- directed facility which can suppress a size increase of a facility layout. A seamless steel pipe heat treatment/purification-directed facility (1) according to an embodiment of the present invention is provided with: a heat treatment device (10) which can perform a heat treatment on a charged seamless steel pipe; a steel pipe inspection device (30) which is disposed on the downstream side of the heat treatment device (10) and detects a surface defect and/or an internal defect of the seamless steel pipe discharged and transported from the heat treatment device (10); a main transportation mechanism (100) provided with a plurality of transportation members which constitutes a main transportation passage (MT) for transporting the seamless steel pipe discharged from the heat treatment device (10) to the steel pipe inspection device (30) disposed on the downstream side of the heat treatment device (10); and a first steel pipe temperature forcibly lowering device (20A) which is disposed above the main transportation passage (MT) on the upstream side of the steel pipe inspection device (30)that is, on the downstream side of the heat treatment device (10) and forcibly lowers the temperature of the seamless steel pipe above the main transportation passage (MT).
Inventors:
KAMITANI HIROKI (JP)
TANAKA TAKANORI (JP)
SOMA ATSUSHI (JP)
KONDO KEIICHI (JP)
MITSUNARI HIDEKI (JP)
OKADA SEIYA (JP)
MATSUMOTO TAKUYA (JP)
YOSHIDA SHINJI (JP)
ARAI YUJI (JP)
TANAKA TAKANORI (JP)
SOMA ATSUSHI (JP)
KONDO KEIICHI (JP)
MITSUNARI HIDEKI (JP)
OKADA SEIYA (JP)
MATSUMOTO TAKUYA (JP)
YOSHIDA SHINJI (JP)
ARAI YUJI (JP)
Application Number:
PCT/JP2019/012820
Publication Date:
October 03, 2019
Filing Date:
March 26, 2019
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C21D9/08; B21B38/00; B21C51/00
Domestic Patent References:
| WO2011118681A1 | 2011-09-29 |
Foreign References:
| JPS57188619A | 1982-11-19 | |||
| JPS56108829A | 1981-08-28 | |||
| JP2005248302A | 2005-09-15 | |||
| JPH0760354A | 1995-03-07 |
Other References:
See also references of EP 3778931A4
Attorney, Agent or Firm:
ASCEND IP LAW FIRM (JP)
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