Title:
SEMICONDUCTOR ADHESIVE COMPOSITION AND SEMICONDUCTOR ADHESIVE FILM COMPRISING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/080286
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor adhesive composition and a semiconductor adhesive film comprising a cured product thereof, and specifically, to: a semiconductor adhesive composition capable of removing a void formed between an adherend and the adhesive, and reducing bleed out; and a semiconductor adhesive film comprising a cured product thereof.
Inventors:
KIM EUN BUM (KR)
LEE KWANG JOO (KR)
KIM JUNG HAK (KR)
KIM JU HYEON (KR)
JANG YOON SUN (KR)
LEE KWANG JOO (KR)
KIM JUNG HAK (KR)
KIM JU HYEON (KR)
JANG YOON SUN (KR)
Application Number:
PCT/KR2020/014322
Publication Date:
April 29, 2021
Filing Date:
October 20, 2020
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J133/04; C08K3/013; C08K3/26; C08K3/36; C08K5/00; C08K5/053; C08L33/04; C08L63/00; C09J7/30; C09J163/00
Foreign References:
| JP2008283199A | 2008-11-20 | |||
| JP2007284576A | 2007-11-01 | |||
| KR20170113430A | 2017-10-12 | |||
| KR20130109070A | 2013-10-07 | |||
| KR20180037217A | 2018-04-11 |
Attorney, Agent or Firm:
PCR INTELLECTUAL PROPERTY LAW FIRM (KR)
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