Title:
SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/130889
Kind Code:
A1
Abstract:
This semiconductor apparatus is provided with a semiconductor element, a conducting member, and a connecting member. The semiconductor element has a back surface on which a first electrode is formed, and a major surface on which a second electrode and a third electrode are formed. The back surface and the major surface are spaced apart from each other in a z-direction. In accordance with a drive signal input to the third electrode, on-off control is performed between the first electrode and the second electrode. The conducting member has a first bonding surface and a second bonding surface, each facing the same direction as the back surface. The first bonding surface has the third electrode bonded thereto. The second bonding surface has the connecting member bonded thereto, and is disposed so as not to overlap the semiconductor element when viewed in the z-direction.
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Inventors:
ISE KOTA (JP)
Application Number:
PCT/JP2021/042420
Publication Date:
June 23, 2022
Filing Date:
November 18, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
| WO2016024333A1 | 2016-02-18 |
Foreign References:
| US20130214399A1 | 2013-08-22 | |||
| JP2013149760A | 2013-08-01 | |||
| JP2014107506A | 2014-06-09 | |||
| JP2015228529A | 2015-12-17 | |||
| US20090212405A1 | 2009-08-27 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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