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Patent Searching and Data


Title:
SEMICONDUCTOR CHAMBER PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/169133
Kind Code:
A1
Abstract:
The present invention relates to a pump system used for vacuumizing the inside of a chamber in a semiconductor manufacturing process, discharging gas and the like generated in the chamber, and maintaining the inside of the chamber at an appropriate pressure. The present invention provides a semiconductor pump system, which: implements a novel pump system for heating or cooling gas moving from a roots rotor side to a screw rotor side by connecting, using an external pipe, a roots rotor region and a screw rotor region, which belong to a pump for forming the internal environment of a process chamber, and by providing a heating/cooling means such as a heater, a cooler, or a combination of a heater and a cooler in the pipe between the roots rotor region and the screw rotor region, so as to prevent powder by-products from being accumulated in the rotor such that a rotor is prevented from being damaged, thereby enabling the operation performance and the durability lifespan of the rotor to improve, and implements a pump system capable of monitoring the internal temperature of the pipe, which is a gas passage connecting the roots rotor region and the screw rotor region of the pump, and selectively performing heating or cooling control according to the state of the gas temperature, such that the pump can be controlled at an optimal temperature suitable for characteristics of each chamber, and the like, thereby enabling equipment to be economically operated. In addition, the present invention provides a semiconductor chamber pump system, which implements a novel reaction by-product gas treatment system capable of efficiently decomposing and treating gas flowing along the inside of the pipe by providing a small-sized plasma apparatus for plasma reaction in the pipe, which is a gas passage connecting the roots rotor region and the screw rotor region of the pump, thereby ensuring performance of the pump and extending the lifespan thereof, and enabling the decomposition and treatment efficiency of the process by-products to improve and, in particular, enabling the decomposition and treatment efficiency of the process by-product gas to remarkably increase by applying a plasma equipment to a fluid transfer pipe having a small diameter (Ø18 to Ø25).

Inventors:
LEE IN CHEOL (KR)
Application Number:
KR2017/006140
Publication Date:
September 20, 2018
Filing Date:
June 13, 2017
Export Citation:
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Assignee:
PLAN CO LTD (KR)
International Classes:
H01L21/02; F04C18/08; H01L21/67
Foreign References:
KR20060029465A2006-04-06
JPH0878300A1996-03-22
KR100605389B12006-08-01
KR101574121B12015-12-03
KR101117098B12012-03-06
KR100778871B12007-11-22
Attorney, Agent or Firm:
HALLA PATENT & LAW FIRM (KR)
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