Title:
SEMICONDUCTOR CHIP INTEGRATED DEVICE MANUFACTURING METHOD, SEMICONDUCTOR CHIP INTEGRATED DEVICE, SEMICONDUCTOR CHIP INTEGRATED DEVICE ASSEMBLY, SEMICONDUCTOR CHIP INK, AND SEMICONDUCTOR CHIP INK EJECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/084783
Kind Code:
A1
Abstract:
A liquid-droplet-like semiconductor chip ink 200 contains a liquid 50 and semiconductor chips 40 having first electrodes and second electrodes on upper surfaces and lower surfaces, and is configured such that the second electrode side portions are more strongly attracted to a magnetic field. The semiconductor chip ink 200 is supplied to a chip joining part on a lower-part electrode 420 that is disposed on a mounting substrate 400, the second electrode side portions of the semiconductor chips 40 in the semiconductor chip ink 200 are attracted by a magnetic force by an external magnetic field so as to make contact with the chip joining part, and thereafter is electrically and mechanically joined to the chip joining part by using soldering and the like. Thereafter, an upper-part electrode in which a single line or a plurality of branch line parts are extended from a main line part so as to cover the chip joining part is formed, and the semiconductor chips 40 each are connected between the lower-part electrode 420 and the upper-part electrode, whereby a semiconductor chip integrated device is manufactured.
Inventors:
TAKEYA MOTONOBU (JP)
Application Number:
PCT/JP2020/018221
Publication Date:
May 06, 2021
Filing Date:
April 30, 2020
Export Citation:
Assignee:
ULDTEC CO LTD (JP)
International Classes:
H01L33/40; G09F9/33; H01L21/58; H01L33/62; H05K1/18
Domestic Patent References:
| WO2012008253A1 | 2012-01-19 |
Foreign References:
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Attorney, Agent or Firm:
MORI Koh-ichi (JP)
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