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Patent Searching and Data


Title:
SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2020/179057
Kind Code:
A1
Abstract:
Provided are semiconductor chip manufacturing devices (10, 20, 30, 40) which fabricate a plurality of LD chips by dividing up a semiconductor wafer (5) which is installed in a housing (2) filled with liquids (1a, 1b, 1c), has partition lines (8) formed thereupon and marking lines (7) engraved thereupon, and has micro-cracks formed along the marking lines (7). The semiconductor chip manufacturing devices (10, 20, 30, 40) comprise: a support base (4) which holds the semiconductor wafer (5); and a blade (3) which applies pressure to the semiconductor wafer (5) along a crack portion (6) comprising the partition lines (8) or marking lines (7). The semiconductor wafer (5) is subjected to pressure along the crack portion (6) in the liquids (1a, 1b, 1c) by means of the blade (3), thereby dividing the wafer into a plurality of LD chips.

Inventors:
UETSUJI TETSUYA (JP)
FUCHIDA AYUMI (JP)
SUZUKI MASATO (JP)
Application Number:
PCT/JP2019/009081
Publication Date:
September 10, 2020
Filing Date:
March 07, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/301; B28D5/00
Foreign References:
JPH05102302A1993-04-23
JP2015226018A2015-12-14
JPH04180651A1992-06-26
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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