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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT, WIRELESS COMMUNICATION APPARATUS, AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/226925
Kind Code:
A1
Abstract:
The present application relates to a semiconductor device, an integrated circuit, a wireless communication apparatus, and a manufacturing method. The semiconductor device comprises: a substrate; a dielectric layer disposed on the substrate; a device region disposed on the dielectric layer and comprising a body region; and a via hole passing through the dielectric layer and used for coupling the body region and the substrate. According to the solution provided in the present application, the self-heating effect of a radio frequency front-end device under high power can be reduced while not increasing additional process development costs and only adding small radio frequency parasitics.

Inventors:
ZHU YU (CN)
TIAN YU (CN)
WANG JINMING (CN)
YANG FAN (CN)
WANG CHEN (CN)
Application Number:
PCT/CN2021/091143
Publication Date:
November 03, 2022
Filing Date:
April 29, 2021
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L29/78; H01L21/336; H01L29/10
Foreign References:
CN104681611A2015-06-03
CN111384007A2020-07-07
CN110828566A2020-02-21
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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