Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/066409
Kind Code:
A1
Abstract:
A semiconductor device comprising a stack (30) of semiconductor chips (10) each
having a semiconductor substrate (12) and a first insulating layer (16) provided
on the side surface of the semiconductor substrate (12) and having a recessed
part (54) in the side surface thereof, and a second metal layer (24) for connecting
first metal layers (20) provided in the central parts of the side surfaces in the
recessed parts (54) to first metal layers (20) provided in the recessed parts
(54) and provided on each semiconductor chip (10). A method for manufacturing
the same is also disclosed.
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Inventors:
HOSHINO MASATAKA (JP)
KASAI JUNICHI (JP)
MEGURO KOUICHI (JP)
FUKUYAMA RYOTA (JP)
SHINMA YASUHIRO (JP)
TAYA KOJI (JP)
ONODERA MASANORI (JP)
MASUDA NAOMI (JP)
KASAI JUNICHI (JP)
MEGURO KOUICHI (JP)
FUKUYAMA RYOTA (JP)
SHINMA YASUHIRO (JP)
TAYA KOJI (JP)
ONODERA MASANORI (JP)
MASUDA NAOMI (JP)
Application Number:
PCT/JP2005/022646
Publication Date:
June 14, 2007
Filing Date:
December 09, 2005
Export Citation:
Assignee:
SPANSION LLC (US)
SPANSION JAPAN LTD (JP)
HOSHINO MASATAKA (JP)
KASAI JUNICHI (JP)
MEGURO KOUICHI (JP)
FUKUYAMA RYOTA (JP)
SHINMA YASUHIRO (JP)
TAYA KOJI (JP)
ONODERA MASANORI (JP)
MASUDA NAOMI (JP)
SPANSION JAPAN LTD (JP)
HOSHINO MASATAKA (JP)
KASAI JUNICHI (JP)
MEGURO KOUICHI (JP)
FUKUYAMA RYOTA (JP)
SHINMA YASUHIRO (JP)
TAYA KOJI (JP)
ONODERA MASANORI (JP)
MASUDA NAOMI (JP)
International Classes:
H01L25/065; H01L23/12; H01L25/07; H01L25/18
Foreign References:
JPH065665A | 1994-01-14 | |||
JP2001210782A | 2001-08-03 | |||
JP2002076167A | 2002-03-15 | |||
JP2004221372A | 2004-08-05 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (6-1 Kyobashi 1-chome, Chuo-k, Tokyo 31, JP)
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