Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE MANUFACTURING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE MANUFACTURING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP HAVING FILM ADHESIVE ATTACHED THERETO
Document Type and Number:
WIPO Patent Application WO/2021/193913
Kind Code:
A1
Abstract:
A semiconductor device manufacturing sheet comprising a substrate, a pressure sensitive adhesive layer, an intermediate layer and a film adhesive, wherein: the pressure sensitive adhesive layer, the intermediate layer and the film adhesive are laminated in said order on the substrate; the intermediate layer comprises, as the main ingredient, a non-silicon resin (β1) having a weight average molecular weight of 20,000-100,000; the film adhesive comprises a liquid ingredient (α2), or the pressure sensitive adhesive layer comprises a liquid ingredient (γ2); and H(βα)-H(β)>7% or H(βγ)-H(β)>7% is satisfied if the haze of a first test piece comprising the non-silicon resin (β1) and having a thickness of 10μm is represented by H(β), the haze of a second test piece comprising a mixture of the non-silicon resin (β1) and the ingredient (α2) and having a thickness of 10μm is represented by H(βα), and the haze of a third test piece comprising a mixture of the non-silicon resin (β1) and the ingredient (γ2) and having a thickness of 10μm is represented by H(βγ).

Inventors:
IWAYA WATARU (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2021/012838
Publication Date:
September 30, 2021
Filing Date:
March 26, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/28; C08L31/04; C08L83/04; H01L21/301
Domestic Patent References:
WO2018083982A12018-05-11
WO2019186990A12019-10-03
WO2020054355A12020-03-19
WO2017078055A12017-05-11
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
Download PDF: