SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2018/159329

A1

This semiconductor device is provided with: a primary molded body (10) formed by having a semiconductor chip (12) that has a detection unit for detecting physical quantities, and a primary molded resin (13) formed of a resin material; a housing component (20), in which an insertion hole (21) for inserting the primary molded body is formed; and a secondary molded resin (30), which is formed of a resin material, and which integrally covers a region exposed from the insertion hole, said region being a part of the surface of the primary molded body, and a housing component surface region including a region surrounding the insertion hole. A primary molded body portion including the semiconductor chip is inserted into the insertion hole.

JPS5853849	SEMICONDUCTOR DEVICE AND PREPARATION THEREOF
WO/2017/051838	THERMOSETTING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICES OBTAINED USING SAME, OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR ELEMENT
JP2022021902	SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

IZUMI RYOSUKE (JP)
YOSHIDA NORIHITO (JP)

PCT/JP2018/005509

September 07, 2018

February 16, 2018

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DENSO CORP (JP)

H01L23/29; B29C33/12; B29C39/10; B29C39/24; H01L21/56; H01L23/31

JP2004125767A	2004-04-22
JP2010071724A	2010-04-02
JP2014103361A	2014-06-05
JP2005007872A	2005-01-13
JP2012174882A	2012-09-10
JP2013096970A	2013-05-20
JP2014132626A	2014-07-17
JP2004281428A	2004-10-07

YOU-I PATENT FIRM (JP)

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