Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/178793
Kind Code:
A1
Abstract:
Provided are a semiconductor device enabling microminiaturization and high integration, and a method for manufacturing the semiconductor device. This semiconductor device has: a first insulating body; an oxide on the first insulating body; a second insulating body and first and second conductive bodies on the oxide; a third conductive body on the second insulating body; a fourth conductive body on the first conductive body; a fifth conductive body on the second conductive body; a third insulating body on the first insulating body and the first and second conductive bodies; a fourth insulating body on the second and third insulating bodies and the third conductive body; and a fifth insulating body on the fourth insulating body. The first and second conductive bodies are provided facing each other by having the second insulating body therebetween. The second insulating body is provided along: the inner wall of an opening that is provided in the third insulating body; the side surfaces of the first and second conductive bodies, said side surfaces facing each other; and the upper surface of the oxide. The height of the upper surface of the third conductive body is set higher than the upper surface height of the second and third insulating bodies, and the fourth insulating body is provided along the upper surfaces of the second and third insulating bodies, and the upper surface and the side surfaces of the third conductive body.
Inventors:
ASAMI YOSHINOBU (JP)
Application Number:
PCT/IB2018/051726
Publication Date:
October 04, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB (JP)
International Classes:
H01L29/786; H01L21/3065; H01L21/336; H01L21/8234; H01L21/8242; H01L27/06; H01L27/088; H01L27/108; H01L27/1156; H01L29/788; H01L29/792
Foreign References:
| JP2016225602A | 2016-12-28 | |||
| JP2016201541A | 2016-12-01 | |||
| JP2016167595A | 2016-09-15 | |||
| JP2016213468A | 2016-12-15 | |||
| JP2016207759A | 2016-12-08 | |||
| JP2016184635A | 2016-10-20 |
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