Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/075016
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device having improved joining reliability between a lead part and a semiconductor element. The semiconductor device includes a semiconductor element and a lead part. The semiconductor element is mounted on a circuit pattern provided to an insulating substrate. The lead part has a plate shape and is joined to the semiconductor element via a first joining member. The lead part includes a lead body and a joining component. The lead body includes an opening section provided so as to correspond to the mounting location of the semiconductor element. The joining component is provided within the opening section and above the semiconductor element. A bottom surface of the joining component is joined to the semiconductor element via the first joining member, and an outer peripheral section of the joining component is joined to an inner periphery of the opening section via a second joining member.
Inventors:
MAEDA ATSUSHI (JP)
KAWASE TATSUYA (JP)
IMOTO YUJI (JP)
KAWASE TATSUYA (JP)
IMOTO YUJI (JP)
Application Number:
PCT/JP2019/040828
Publication Date:
April 22, 2021
Filing Date:
October 17, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017208430A1 | 2017-12-07 |
Foreign References:
| JP2011253862A | 2011-12-15 | |||
| JP2008182074A | 2008-08-07 | |||
| JP2017069581A | 2017-04-06 | |||
| JP2010245212A | 2010-10-28 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF:
Previous Patent: OPTICAL PULSE TESTING METHOD AND OPTICAL PULSE TESTING DEVICE
Next Patent: INFORMATION PROCESSING METHOD
Next Patent: INFORMATION PROCESSING METHOD