Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205792
Kind Code:
A1
Abstract:
The purpose of the present invention is to effectively utilize the region of an encapsulating portion. This semiconductor device comprises a semiconductor element, a substrate, an encapsulating portion, and a hollow region. The substrate of the semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The encapsulating portion of the semiconductor device is configured in a shape to cover an upper surface opposing the bottom surface of the semiconductor element, and encapsulates the semiconductor element. The hollow region of the semiconductor device is a region disposed in the encapsulating portion in which a hollow is formed.
Inventors:
ISHII SHIGEKAZU (JP)
ELLIOTT-BOWMAN BERNADETTE (GB)
WRIGHT CHRISTOPHER (GB)
BEARD TIMOTHY (GB)
LAWRENSON MATTHEW (GB)
KOBAYASHI HIROTAKA (JP)
SHIGETA HIROYUKI (JP)
ELLIOTT-BOWMAN BERNADETTE (GB)
WRIGHT CHRISTOPHER (GB)
BEARD TIMOTHY (GB)
LAWRENSON MATTHEW (GB)
KOBAYASHI HIROTAKA (JP)
SHIGETA HIROYUKI (JP)
Application Number:
PCT/JP2021/008625
Publication Date:
October 14, 2021
Filing Date:
March 05, 2021
Export Citation:
Assignee:
SONY GROUP CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/02; H01L23/28
Domestic Patent References:
| WO2017028778A1 | 2017-02-23 |
Foreign References:
| JP2009026791A | 2009-02-05 | |||
| JP2019050267A | 2019-03-28 | |||
| JP2018018719A | 2018-02-01 |
Other References:
See also references of EP 4135021A4
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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