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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MODULE
Document Type and Number:
WIPO Patent Application WO/2021/149687
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor substrate that has a first principal surface and a second principal surface in a thickness direction, as well as a first end surface and a second end surface in a length direction orthogonal to the thickness direction; and a circuit layer provided to the first principal surface of the semiconductor substrate. The semiconductor device is characterized in that: the semiconductor substrate has, on a first end surface side that is a second external electrode-side end surface in the length direction, a first end region where no circuit layer has been provided on the semiconductor substrate; a first exposed part where the semiconductor substrate, with the exception of the first principal surface, is exposed between the first principal surface and the first end surface, is provided to the first end region; and in a cut plane obtained by cutting the semiconductor substrate in directions parallel to the thickness direction and the length direction of the semiconductor substrate, when the first end region is divided into two in the thickness direction by a dividing line dividing into two, at the center of the thickness direction, the semiconductor substrate in the portion where the circuit layer is provided on the first principal surface, the surface area of a first region that is the first principal surface-side region is smaller than the surface area of a second region that is the second principal surface-side region.

Inventors:
HARADA MASATOMI (JP)
KAGAWA TAKESHI (JP)
MATSUBARA HIROSHI (JP)
ADACHI NOBUYOSHI (JP)
Application Number:
PCT/JP2021/001713
Publication Date:
July 29, 2021
Filing Date:
January 19, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L27/04; H01G4/30; H01G4/33; H01L21/60; H01L21/822
Foreign References:
US20190096986A12019-03-28
KR20080061154A2008-07-02
JP2008252011A2008-10-16
JPH06140275A1994-05-20
JP2009010114A2009-01-15
JP2007220985A2007-08-30
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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