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Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/210344
Kind Code:
A1
Abstract:
A semiconductor device comprising: a semiconductor element (11); a conductive material (10) joined to the side of the reverse surface (11b) of the semiconductor element; and a sealing material (12) that covers a portion of the conductive material and side surfaces (11c) of the semiconductor element. The semiconductor device further comprises: an insulating layer (151) that covers a portion of the sealing material and the obverse surface (11a) of the semiconductor element; a first electrode (13) and a second electrode (14) that are connected to the semiconductor element; and a rewiring layer (15) having a first externally exposed layer (152) which is conductive and covers a portion of the first electrode exposed from the insulating layer, and a second externally exposed layer (153) which is conductive and covers a portion of the second electrode exposed from the insulating layer. In the second electrode, an end on the opposite side of the semiconductor element is extended to a position of the rewiring layer outside an outline of the semiconductor element. The second externally exposed layer covers a partial region located outside the outline of the semiconductor element in the second electrode. In the conductive material, a lower surface (10b) that is on the opposite side to an upper surface (10a) and that is joined to the reverse surface of the semiconductor element, is exposed from the sealing material.

Inventors:
NAKANO TAKAHIRO (JP)
OOSAWA SEIGO (JP)
OOKURA YASUSHI (JP)
MIZUNO NAOHITO (JP)
INUTSUKA YOSHIHIRO (JP)
Application Number:
PCT/JP2021/011411
Publication Date:
October 21, 2021
Filing Date:
March 19, 2021
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L23/12; H01L23/34; H01L23/48; H01L25/07; H01L25/18
Foreign References:
US6271469B12001-08-07
JP2002016196A2002-01-18
JP2015126119A2015-07-06
JP2012243890A2012-12-10
JPH06302727A1994-10-28
JPH0846090A1996-02-16
JP2003110064A2003-04-11
JP2020047696A2020-03-26
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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