Title:
SEMICONDUCTOR DEVICE AND MODULE
Document Type and Number:
WIPO Patent Application WO/2021/221087
Kind Code:
A1
Abstract:
The present invention provides a semiconductor device comprising a circuit layer provided on a first main surface of a semiconductor substrate. The circuit layer is provided with a first electrode layer, a dielectric layer, a second electrode layer, a first external electrode, and a second external electrode. When the circuit layer is viewed from above: the first electrode layer has a first facing part that faces the second electrode layer in the thickness direction, and a first non-facing part that does not face the second electrode layer; the second electrode layer has a second facing part that faces the first electrode layer, and a second non-facing part that does not face the first electrode layer; the first external electrode is positioned further toward the second-end-surface side of the semiconductor substrate than the second external electrode; the center of gravity of the first electrode layer is positioned further toward the second-end-surface side than the center of gravity of the second electrode layer; and the proportion P1 of the area occupied by the first electrode layer in a second electrode layer non-formation region, which is a region that is further toward the second-end-surface side than the second-end-surface-side end part of the second facing part, among the regions of the semiconductor substrate, is 80-100% inclusive.
Inventors:
ADACHI NOBUYOSHI (JP)
Application Number:
PCT/JP2021/016915
Publication Date:
November 04, 2021
Filing Date:
April 28, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L27/04; H01G2/06; H01G4/30; H01G4/33; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| WO2018083973A1 | 2018-05-11 |
Foreign References:
| JP2008516441A | 2008-05-15 | |||
| JP2014036170A | 2014-02-24 | |||
| JP2017228638A | 2017-12-28 | |||
| JP2002506283A | 2002-02-26 | |||
| JPH0689831A | 1994-03-29 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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