Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/154077
Kind Code:
A1
Abstract:
Provided are a semiconductor device and a semiconductor module that make it possible to improve the heat-dissipating property of a semiconductor device having a heat-generating element. A semiconductor device (101) is provided with: a P-type semiconductor substrate (301) having a major surface (401) and a major surface (402) opposing the major surface (401); an N-type N-well (302) provided on the major surface (401) side of the semiconductor substrate (301); a unit field-effect transistor (303) provided in the N-well (302); a P-type heat-dissipating guard ring region (305) provided on the major surface (401) side of the semiconductor substrate (301) outside the N-well in a plan view of the semiconductor substrate (301); wiring (504) provided on the heat-dissipating guard ring region (305); a bump installing portion (5041, 5043); and a bump (5042, 5044).
Inventors:
MORISAWA FUMINORI (JP)
UEDA KAZUHIRO (JP)
UEDA KAZUHIRO (JP)
Application Number:
PCT/JP2022/001066
Publication Date:
July 21, 2022
Filing Date:
January 14, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L27/04; H01L23/34; H01L25/07; H01L25/18; H05K7/20
Foreign References:
| JP2014099470A | 2014-05-29 | |||
| JP2017126668A | 2017-07-20 | |||
| JP2010177478A | 2010-08-12 | |||
| JP2020188082A | 2020-11-19 | |||
| JPH11238734A | 1999-08-31 | |||
| JP2015015388A | 2015-01-22 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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