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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, MOVING BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/234892
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology which is capable of suppressing positional shift of an electronic component and a solder ball without using a jig. A semiconductor device according to the present invention is provided with an insulating substrate, an electronic component and a solder. The insulating substrate is provided with a metal pattern and a semiconductor element. The metal pattern has a first dent and a second dent; and the second dent is arranged side by side with the first dent. A part of the electronic component is arranged within the first dent. The solder connects the electronic component and the metal pattern arranged on the insulating substrate with each other.

Inventors:
HIGASHIHATA Takeshi (JP)
Application Number:
PCT/JP2020/020057
Publication Date:
November 25, 2021
Filing Date:
May 21, 2020
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (JP)
International Classes:
H01L23/12; H01L25/00; H01L25/07; H01L25/18
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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