Title:
SEMICONDUCTOR DEVICE, THERMOSETTING RESIN COMPOSITION USED FOR PRODUCTION THEREOF, AND DICING DIE BONDING INTEGRATED TAPE
Document Type and Number:
WIPO Patent Application WO/2019/220540
Kind Code:
A1
Abstract:
The semiconductor device according to the present invention includes: a substrate; a first semiconductor element that is disposed on the substrate; a first encapsulation layer that encapsulates the first semiconductor element; and a second semiconductor element that is disposed so as to cover the surface of the first encapsulation layer opposite the surface thereof on the substrate side, and that has an area larger than that of the first semiconductor element. The first encapsulation layer is formed from a cured product of a thermosetting resin composition that has a melt viscosity at 120°C of 2500 to 11500 Pa∙s.
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Inventors:
YAMAMOTO KAZUHIRO (JP)
Application Number:
PCT/JP2018/018765
Publication Date:
November 21, 2019
Filing Date:
May 15, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C08L33/04; C08L63/00; H01L21/301; H01L21/52; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2018014501A | 2018-01-25 | |||
| JP2010182816A | 2010-08-19 | |||
| JP2012191027A | 2012-10-04 | |||
| JP2015120836A | 2015-07-02 | |||
| JP2010118554A | 2010-05-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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