SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2010/052770

A1

An external device (H) such as a mobile phone or a digital communication device includes a mobile RF section (23) and a host MPU (21). The mobile RF section (23) performs high frequency power amplification to output a high frequency signal for performing wireless communication via an antenna, a signal processing to transmit the signal received by the antenna in wireless communication to the host MPU (21), and the like. The host MPU (21) performs all controls in the external device (H). The host MPU (21) is connected to a SIM card socket portion (14) which is inserted in a semiconductor device (1) via an ISO terminal (20). The SIM card socket portion (14) can be removed from the semiconductor device (1) at a connection point between a secure chip for SIM (22) and an NFC chip (9a) of the semiconductor device (1).

JP4896932	Input device
JPH10224446	HAND-FREE TELEPHONE DEVICE AND TELEPHONE SYSTEM USING THE DEVICE
JP2022553066	Foldable assemblies and foldable display terminals

NISHIZAWA HIROTAKA (JP)
IWASAKI HIRONORI (JP)
MIYAKE JUN (JP)
FUKASAWA SHINICHI (JP)
WADA TAMAKI (JP)
SHIOTA SHIGEMASA (JP)
KOIKE HIDEO (JP)

PCT/JP2008/070125

May 14, 2010

November 05, 2008

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RENESAS TECH CORP (JP)
NISHIZAWA HIROTAKA (JP)
IWASAKI HIRONORI (JP)
MIYAKE JUN (JP)
FUKASAWA SHINICHI (JP)
WADA TAMAKI (JP)
SHIOTA SHIGEMASA (JP)
KOIKE HIDEO (JP)

H04M1/02; G06K17/00; H04B5/02; H04M1/675

JP2008259200A	2008-10-23
JP2008522466A	2008-06-26

TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)

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