Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/066420
Kind Code:
A1
Abstract:
A semiconductor device is provided with: a first chip (10) including a first switching element (12) that limits a flow of electric current in one direction in a current path; a second chip (20) including a second switching element (22) that limits a flow of electric current in the opposite direction to the one direction in the current path; wiring (30) serving as a relay between the first chip and the second chip and thereby forming a part of the current path; a lead frame (40) which comprises a first lead (42) with the first chip fixedly arranged thereon and a second lead (44) with the second chip fixedly arranged thereon, and which forms a current path; and a mold resin (60) which integrally seals the first chip, the second chip, the wiring, and the lead frame. The wiring is a shunt resistance including a resistor (32). The lead frame further includes a sense terminal (100e, 100f, 46) for detecting a voltage drop across the resistor.
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Inventors:
HAYASHI HIROMASA (JP)
TOMOTO SHUNSUKE (JP)
MORI YUSUKE (JP)
TOMOTO SHUNSUKE (JP)
MORI YUSUKE (JP)
Application Number:
PCT/JP2017/034829
Publication Date:
April 12, 2018
Filing Date:
September 27, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
WO2016075985A1 | 2016-05-19 |
Foreign References:
JP2010267789A | 2010-11-25 | |||
JP2011254387A | 2011-12-15 | |||
US20150115313A1 | 2015-04-30 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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