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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/105476
Kind Code:
A1
Abstract:
The semiconductor device A1 according to the present disclosure is provided with: semiconductor elements 10 (semiconductor elements 10A, 10B) having an element main surface and an element reverse surface facing mutually opposite directions in the z-direction; a support substrate 20 for supporting the semiconductor element 10; electroconductive blocks 60 (first block 61, second block 62) bonded to the element main surface with a first electroconductive bonding material (block bonding materials 610, 620) interposed therebetween; and metal members (lead member 40, input terminal 32) electrically connected to the semiconductor element 10 with an electroconductive block 60 interposed therebetween. The electroconductive blocks 60 have a thermal expansion coefficient smaller than that of the metal members. The electroconductive blocks 60 and the metal members are bonded by a welded part (welded parts M4, M2) in which a part of the electroconductive block 60 and a part of the metal member are fused together. Such a configuration makes it possible to improve resistance against heat cycles.

Inventors:
YOSHIHARA KATSUHIKO (JP)
Application Number:
PCT/JP2019/043872
Publication Date:
May 28, 2020
Filing Date:
November 08, 2019
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48; H01L21/60; H01L25/07; H01L25/18
Domestic Patent References:
WO2016072429A12016-05-12
Foreign References:
JP2015149326A2015-08-20
JP2009105267A2009-05-14
JP2008066561A2008-03-21
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
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