Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179171
Kind Code:
A1
Abstract:
A semiconductor device (1) is provided with a semiconductor module (20) and a fan device (30). The semiconductor module (20) is provided with: a module substrate (21); and a first element (22) and a second element (23a) that are mounted on the module substrate (21), the second element having a smaller heat generation amount and a lower heat resistance than the first element. In the flowing direction of an air flow (F) generated through driving of the fan device (30), the fan device (30) is disposed on the downstream side of the first element (22) and the second element (23a), and the first element (22) is disposed on the downstream side of the second element (23a).
Inventors:
NARUSE TAKANOBU (JP)
ARAKI HIROYOSHI (JP)
ARAKI HIROYOSHI (JP)
Application Number:
PCT/JP2019/048467
Publication Date:
September 10, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
AISIN AW CO (JP)
International Classes:
H01L23/467; H05K7/20
Foreign References:
| JP2007208116A | 2007-08-16 | |||
| JPS6428896A | 1989-01-31 | |||
| JPH03153095A | 1991-07-01 | |||
| JPH10275883A | 1998-10-13 | |||
| JP2005110428A | 2005-04-21 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
Download PDF: