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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184050
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a semiconductor element (40) having a first main electrode (41C) on one surface side and a second main electrode (41E) on a back surface side; a substrate (50) including first and second substrates (50C, 50E) respectively connected to the first and second main electrodes; a main terminal (71) including first and second main terminals (71C, 71E) respectively connected to the first and second main electrodes via the first and second substrates; and a bonding member (80). The bonding member is interposed between the first and second main electrodes and the first and second substrates, respectively. At least one of the first and second main terminals includes a plurality of corresponding main terminals. The first and second main terminals are arranged alternately in one direction orthogonal to a thickness direction of the semiconductor element. The first and second main terminals are bonded to the first and second substrates directly without the bonding member therebetween.

Inventors:
YAMADA SUSUMU (JP)
OMAE SHOICHIRO (JP)
NAGASE TAKUO (JP)
Application Number:
PCT/JP2020/005568
Publication Date:
September 17, 2020
Filing Date:
February 13, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Foreign References:
JP2016226131A2016-12-28
JP2014050206A2014-03-17
JP2015115464A2015-06-22
Attorney, Agent or Firm:
JIN Shunji (JP)
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