Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184051
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a semiconductor element (40) having a first main electrode (41C) on one surface side thereof and a second main electrode (41E) on the rear surface side thereof; a first heat dissipation member (50C) connected to the first main electrode on the one surface side and a second heat dissipation member (50E) on the rear surface side; and a lead frame (60) including a first main terminal (61C) connected to the first heat dissipation member and a second main terminal (61E) connected to the second main electrode. The second main terminal has: a connection part (62E) with respect to the second main electrode; a facing part (64E) that is extended from the connection part and faces the first heat dissipation member; and a non-facing part (65E) that is opposite to the connection part and is contiguous to the facing part and that is aligned with the first main terminal in one direction orthogonal to a thickness direction. The second heat dissipation member is connected to the semiconductor element via the second main terminal. The lead frame has a plurality of the first main terminals and/or a plurality of the non-facing parts of the second main terminals. The non-facing parts are alternately aligned such that lateral surfaces thereof face each other, and a plurality of pairs of the lateral surfaces facing each other are formed.
Inventors:
OMAE SHOICHIRO (JP)
ISHINO HIROSHI (JP)
ISHINO HIROSHI (JP)
Application Number:
PCT/JP2020/005569
Publication Date:
September 17, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; H01L23/48
Foreign References:
| JP2007251076A | 2007-09-27 | |||
| JP2016066700A | 2016-04-28 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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