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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/255256
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a substrate; a first semiconductor region which is formed on the substrate; a second semiconductor region which is formed on the substrate and which is electrically connected to the first semiconductor region; a third semiconductor region which is formed on the substrate and which is positioned between the first semiconductor region and the second semiconductor region; a fourth semiconductor region which is formed on the first semiconductor region; a fifth semiconductor region which is formed on the second semiconductor region and which is electrically connected to the fourth semiconductor region; a sixth semiconductor region which is formed on the third semiconductor region and which is positioned between the fourth semiconductor region and the fifth semiconductor region; and a wiring which is formed between the first semiconductor region and the second semiconductor region and between the fourth semiconductor region and the fifth semiconductor region, and which comprises a conductor that covers the third semiconductor region and the sixth semiconductor region.

Inventors:
SOBUE ISAYA (JP)
KOMURO HIDEYUKI (JP)
Application Number:
PCT/JP2019/024107
Publication Date:
December 24, 2020
Filing Date:
June 18, 2019
Export Citation:
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Assignee:
SOCIONEXT INC (JP)
International Classes:
H01L21/822; H01L21/8234; H01L27/04; H01L27/088
Domestic Patent References:
WO2017191799A12017-11-09
WO2017145906A12017-08-31
Foreign References:
US20140175515A12014-06-26
JP2018064125A2018-04-19
JP2006080519A2006-03-23
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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