Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/059947
Kind Code:
A1
Abstract:
Provided is a semiconductor device (1A) comprising: a semiconductor element; a supporting board supporting the semiconductor element; a wiring unit electrically connected to the semiconductor element; and a resin member (50) sealing the semiconductor element. The resin member (50) is provided with a first driving-side opening part (59A), a second driving-side opening part (59B), a first control-side opening part (58A), and a second control-side opening part (58B), in which a part of the wiring unit is exposed and on which electronic parts electrically connected to the wiring unit can be mounted.
Inventors:
SAWADA HIDEKI (JP)
Application Number:
PCT/JP2020/033835
Publication Date:
April 01, 2021
Filing Date:
September 07, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L21/56; H01L21/60; H01L23/31; H01L23/48; H01L23/62; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| WO2014033857A1 | 2014-03-06 | |||
| WO2016199635A1 | 2016-12-15 |
Foreign References:
| JP2008016822A | 2008-01-24 | |||
| JP2017208912A | 2017-11-24 | |||
| JP2018018880A | 2018-02-01 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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