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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065736
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element (30) having an emitter electrode formed on a surface thereof and a collector electrode formed on a back surface thereof. The collector electrode and a heatsink (40) disposed on the back surface side of the semiconductor element (30) are connected via solder (80). A solder bonding portion has a plurality of wire pieces (90). All the wire pieces (90) are bonded to a mounting surface (40a) of the heatsink (40), and protrude toward the semiconductor element (30). The solder (80) includes a central region (80a) overlapping, in a plan view, a central portion of the semiconductor element (30) including an element center (30c), and an outer peripheral region (80b) surrounding the central region (80a). Four or more wire pieces are disposed respectively corresponding to four corners of at least the semiconductor element (30) in the outer peripheral region. At least one of the wire pieces extends toward the element center in the plan view.

Inventors:
FUKUOKA Daisuke (1-1 Showa-ch, Kariya-city Aichi 61, JP)
OKUMURA Tomomi (1-1 Showa-ch, Kariya-city Aichi 61, JP)
OOTANI Yuuji (1-1 Showa-ch, Kariya-city Aichi 61, JP)
KOBAYASHI Wataru (1-1 Showa-ch, Kariya-city Aichi 61, JP)
NOMURA Takumi (1-1 Showa-ch, Kariya-city Aichi 61, JP)
MITSUNAGA Tomoaki (1 Toyota-ch, Toyota-shi Aichi 71, JP)
HIRANO Takahiro (1 Toyota-ch, Toyota-shi Aichi 71, JP)
SAKAI Takamichi (1-1 Showa-ch, Kariya-city Aichi 61, JP)
OKA Kengo (1-1 Showa-ch, Kariya-city Aichi 61, JP)
Application Number:
JP2020/036372
Publication Date:
April 08, 2021
Filing Date:
September 25, 2020
Export Citation:
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Assignee:
DENSO CORPORATION (Kariya-city Aichi, 61, JP)
International Classes:
H01L25/07; H01L25/18; H01L21/52
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (Takisada Bldg. 2-13-19, Nishiki, Naka-k, Nagoya-city Aichi 03, JP)
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