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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/200094
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device which maintains the flatness of a glass substrate and which can sufficiently protect the ends of the glass substrate. This semiconductor device is provided with: a glass substrate which includes a first surface, a second surface opposite of the first surface, and a first lateral surface between the first surface and the second surface; wiring which is provided on the first and second surfaces; a metal film which covers the first lateral surface; and a frame which is provided outside of the metal film and which is adhered to the metal film on the first lateral surface.

Inventors:
HOGYOKU SUSUMU (JP)
MORITA SHINYA (JP)
TAKAMORI REI (JP)
OKA SHUICHI (JP)
Application Number:
PCT/JP2021/010492
Publication Date:
October 07, 2021
Filing Date:
March 16, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/02; H01L23/08; H01L23/12; H01L23/15; H01L23/36; H01L27/146
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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