Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/229837
Kind Code:
A1
Abstract:
A semiconductor device is provided with: a substrate having a circuit pattern and including a first circuit board and a second circuit board positioned at a distance from the first circuit board; a semiconductor chip that is positioned on the first circuit board and in which a current flows in the thickness direction; a capacitor connecting the first circuit board and the second circuit board. The semiconductor chip includes: a semiconductor layer; a first electrode pad positioned on one side, with respect to the thickness direction, of the semiconductor layer so as to face the first circuit board; and a second electrode pad positioned on the other side, with respect to the thickness direction, of the semiconductor layer. The semiconductor device further includes a first wire connecting the second electrode pad and the second circuit board.

Inventors:
KANEDA TATSUSHI (JP)
OOMORI HIROTAKA (JP)
KIMURA REN (JP)
Application Number:
PCT/JP2020/034571
Publication Date:
November 18, 2021
Filing Date:
September 11, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L25/00; H01L25/07; H01L25/18
Domestic Patent References:
WO2016084241A12016-06-02
WO2018194153A12018-10-25
WO2018186353A12018-10-11
WO2019163205A12019-08-29
Foreign References:
JP2018200918A2018-12-20
JP2012210153A2012-10-25
JP2019017112A2019-01-31
JP2011238906A2011-11-24
JP2019080417A2019-05-23
Attorney, Agent or Firm:
KITANO, Shuhei et al. (JP)
Download PDF: