Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/070384
Kind Code:
A1
Abstract:
A semiconductor device (100) according to the present disclosure comprises a semiconductor chip (130) in which are formed a protruding terminal (14) that electrically connects to a transistor (13) and that has a greater cross-sectional area than a bonding wire (4) and a short circuit prevention side wall (15) that is insulating and that covers side surfaces that face the surroundings of the protruding terminal (14). The semiconductor chip (130) is bonded to the upper surface (3) of a metal plate (2) by a conductive bonding material 6. A conductor pattern (34a) that is formed in a circuit board (30) bonded to the upper surface (3) of the metal plate (2) is connected via the bonding wire (4) to the projection-direction tip of the protruding terminal (14).
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Inventors:
KANAYA KO (JP)
Application Number:
PCT/JP2020/037425
Publication Date:
April 07, 2022
Filing Date:
October 01, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/12; H01L23/02; H01L23/52; H01P5/08; H03F3/60
Foreign References:
| JP2012243781A | 2012-12-10 | |||
| JP2012234910A | 2012-11-29 | |||
| JP2015041757A | 2015-03-02 | |||
| JP2001267466A | 2001-09-28 | |||
| JPH11233689A | 1999-08-27 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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